Issei Okada
14Patents
3h-index
18Co-inventors
53Inventor score
Filing activity: Feb 23, 2004 → Oct 4, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7445731B2 | Metallic colloidal solution and inkjet-use metallic ink | Electricity | 11 | Expired |
| US7608203B2 | Metallic colloidal solution and inkjet-use metallic ink | Electricity | 7 | Active |
| US7691175B2 | Granular metal powder | Performing Operations; Transporting | 4 | Expired |
| US7510592B2 | Method of producing metal powder | Electricity | 1 | Expired |
| US10610928B2 | Powder for conductive material, ink for conductive material, conductive paste, and method for producing powder for conductive material | Chemistry; Metallurgy | 1 | Active |
| US7285152B2 | Method of manufacturing chain-structure metal powder | Electricity | 0 | Expired |
| US11752734B2 | Base material for printed circuit board and printed circuit board | Electricity | 0 | Active |
| US9967976B2 | Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board | Electricity | 0 | Active |
| US11465208B2 | Method of manufacturing copper nano-ink and copper nano-ink | Performing Operations; Transporting | 0 | Active |
| US8507104B2 | Metal coating, forming method thereof, and metal wiring | Emerging Cross-Sectional Technologies | 0 | Active |
| US10796812B2 | Coating liquid for forming conductive layer, method for producing conductive layer, and conductive layer | Electricity | 0 | Active |
| US8026185B2 | Method for manufacturing electronic circuit component | Electricity | 0 | Active |
| US10307825B2 | Metal powder, ink, sintered body, substrate for printed circuit board, and method for manufacturing metal powder | Chemistry; Metallurgy | 0 | Active |
| US11013113B2 | Base material for printed circuit board and printed circuit board | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.