Plasma generating apparatus using mutual inductive coupling and substrate treating apparatus comprising the same
US10312060B2 · kind B2 · utility
0Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2014 |
| Grant date | Jun 4, 2019 |
| Priority date | — |
| Expiry date | Sep 11, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32174
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Provided are a plasma generating apparatus using mutual inductive coupling and a substrate treating apparatus including the same. According to an embodiment of the present invention, a plasma generating apparatus includes: an RF power supply providing an RF signal; a plurality of electromagnetic field applying units inducing an electromagnetic field by receiving the RF signal; and a reactance element connected to a ground terminal of the electromagnetic field applying unit, wherein each of the electromagnetic field applying units may include a plurality of mutually-inductively coupled coils.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.