Methods and system for controlling a surface profile of a wafer
US10315337B2 · kind B2 · utility
2Cited by
4References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2016 |
| Grant date | Jun 11, 2019 |
| Priority date | — |
| Expiry date | Aug 3, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/50285
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
Methods for controlling the surface profiles of wafers sliced from an ingot with a wire saw include measuring an amount of displacement of a sidewall of a frame of the wire saw. The sidewall is connected to a bearing of a wire guide supporting a wire web in the wire saw. The measured amount of displacement of the sidewall is stored as displacement data. Based on the stored data, a pressure profile for adjusting a position of the sidewall is determined by a computing device. Pressure is applied to the sidewall using a displacement device according to the determined pressure profile to control the position of the sidewall.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.