Method for the rapid processing of polymer layers in support of imidization processes and fan out wafer level packaging including effiecient drying of precursor layers
US10319612B2 · kind B2 · utility
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17Claims
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Key dates
| Filing date | Oct 29, 2018 |
| Grant date | Jun 11, 2019 |
| Priority date | — |
| Expiry date | Oct 29, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2274/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process for the drying, and subsequent imidization, of polyimide precursors which minimizes or eliminates voids and which minimizes or eliminates discoloration. The process uses a sequential set of descending pressure operations that allow for time efficient processing of wafers. The set of descending pressure operations are interspersed with evacuation processes using heated gasses, which combine heating and byproduct evacuation. The process results in layers with reduced or eliminated voiding, discoloration, and solvent retention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.