Substrate conveying method and substrate processing system
US10319622B2 · kind B2 · utility
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2References
4Claims
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Key dates
| Filing date | Jan 25, 2017 |
| Grant date | Jun 11, 2019 |
| Priority date | — |
| Expiry date | Mar 9, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67742
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a substrate conveying method including: holding a substrate by a holder; rotating the substrate while conveying the substrate; specifying a position of an edge of the substrate based on a position of the holder when the edge of the substrate crosses a facing surface of a sensor that is disposed on a conveyance trajectory of the substrate, and a position of the sensor; and removing an influence of the rotation of the substrate from the specified position of the edge of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.