Patent · US Active

Elastomeric layer fabrication for light emitting diodes

US10319705B2 · kind B2 · utility

0Cited by
2References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 20, 2017
Grant dateJun 11, 2019
Priority date
Expiry dateOct 20, 2037

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10H20/824
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

An elastomeric interface layer (elayer) is formed over multiple light emitting diode (LED) dies by depositing photoresist materials across multiple LED dies, and using the LED dies as a photolithography mask to facilitate formation of the elayer on each LED die. The elayer facilitates adhesive attachment of each LED die with a pick and place head (PPH), allowing the LED dies to be picked up and placed onto a display substrate including control circuits for sub-pixels of an electronic display. In some embodiments, the LED dies are micro-LED (μLED) dies.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.