Inventor · Cork, IE

Daniel Brodoceanu

40Patents
2h-index
29Co-inventors
49Inventor score

Filing activity: Oct 20, 2017 → May 23, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US10998286B1 Laser-induced selective heating for microLED placement and bonding Electricity 7 Active
US11424214B1 Hybrid interconnect for laser bonding using nanoporous metal tips Electricity 2 Active
US11296268B1 Magnetic clamping interconnects Electricity 2 Active
US11349053B1 Flexible interconnect using conductive adhesive Electricity 2 Active
US11255529B1 Bonding corners of light emitting diode chip to substrate using laser Electricity 2 Active
US10586725B1 Method for polymer-assisted chip transfer Electricity 2 Active
US10840418B1 Fabricating parabolic-shaped LEDs Electricity 2 Active
US10832933B1 Dry-etching of carrier substrate for microLED microassembly Electricity 1 Active
US10269781B1 Elastomeric layer fabrication for light emitting diodes Electricity 1 Active
US11417792B1 Interconnect with nanotube fitting Electricity 1 Active
US11374148B2 Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating Electricity 1 Active
US11107948B1 Fluidic pick-up head for assembling light emitting diodes Electricity 1 Active
US11152533B1 Etchant-accessible carrier substrate for display manufacture Electricity 1 Active
US11239400B1 Curved pillar interconnects Electricity 1 Active
US10818643B1 Rigid pickup head with conformable layer Electricity 1 Active
US11328942B1 Liquid crystalline elastomer for pick and place of semiconductor devices Electricity 1 Active
US10964867B2 Using underfill or flux to promote placing and parallel bonding of light emitting diodes Electricity 1 Active
US11563142B2 Curing pre-applied and plasma-etched underfill via a laser Electricity 0 Active
US11579182B1 Probe card for efficient screening of highly-scaled monolithic semiconductor devices Electricity 0 Active
US11404600B2 Display device and its process for curing post-applied underfill material and bonding packaging contacts via pulsed lasers Electricity 0 Active
US10319705B2 Elastomeric layer fabrication for light emitting diodes Electricity 0 Active
US11276672B1 Bonding dummy electrodes of light emitting diode chip to substrate Electricity 0 Active
US10910514B1 Molded etch masks Electricity 0 Active
US11557692B2 Selectively bonding light-emitting devices via a pulsed laser Electricity 0 Active
US11670531B2 Bridge pick-up head for transferring semiconductor devices Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.