Retaining ring for CMP

US10322492B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Andrew J. Nagengast · Sunnyvale, US
• Christopher Heung-Gyun Lee · San Jose, US
• Thomas Li · Mountain View, US
• Anand N. Iyer · Cupertino, US
• Jie Diao · Fremont, US
• Huanbo Zhang · San Jose, US
• Erik S. Rondum · San Ramon, US
• Wei-Cheng Lee · Los Altos Hills, US
• Jeonghoon Oh · San Jose, US

Key dates

• Filing date: Jul 24, 2017
• Grant date: Jun 18, 2019
• Expiry date: Jul 24, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/68735
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A retaining ring includes a generally annular body having an inner surface to constrain a substrate and a bottom surface, the bottom surface having a plurality of channels extending from an outer surface to the inner surface, and a plurality of islands separated by the channels and providing a contact area to contact a polishing pad, wherein the contact area is about 15-40% of a plan area of the bottom surface.