MEMS device with reduced dynamic stress and methods
US10322926B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2015 |
| Grant date | Jun 18, 2019 |
| Priority date | — |
| Expiry date | Jul 22, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2203/0361
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A structure for a MEMS device includes a MEMS layer comprising a mass portion and a spring portion, a substrate coupled to the MEMS layer, wherein the substrate comprises a planar region and an stopper region, wherein the MEMS device and the substrate are oriented in a plurality of relative orientations in response to an external force, wherein the spring portion and the stopper region are configured to disengagingly impact when the external force exceeds a first threshold force, wherein the mass portion and the planar region are configured to disengagingly impact when the external force exceeds a second threshold force, and wherein the second threshold force exceeds the first threshold force.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.