Te-Hsi Lee
11Patents
3h-index
21Co-inventors
52Inventor score
Filing activity: Dec 31, 2009 → Sep 29, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8878312B2 | Electrical bypass structure for MEMS device | Emerging Cross-Sectional Technologies | 15 | Active |
| US9075079B2 | Method and structure of an integrated MEMS inertial sensor device using electrostatic quadrature-cancellation | Physics | 5 | Active |
| US9249012B2 | Method and device of MEMS process control monitoring and packaged MEMS with different cavity pressures | Performing Operations; Transporting | 4 | Active |
| US9379733B1 | Synchronous modulation resonator with sigma delta modulator | Electricity | 2 | Active |
| US10759656B2 | MEMS sensor with dual pendulous proof masses | Physics | 1 | Active |
| US10267636B1 | Method to test the quality factor of a MEMS gyroscope at chip probe | Performing Operations; Transporting | 0 | Active |
| US9950921B2 | MEMS structure with improved shielding and method | Performing Operations; Transporting | 0 | Active |
| US10046964B2 | MEMS structure with improved shielding and method | Performing Operations; Transporting | 0 | Active |
| US10322926B1 | MEMS device with reduced dynamic stress and methods | Performing Operations; Transporting | 0 | Active |
| US8237263B2 | Method and apparatus for cooling an integrated circuit | Electricity | 0 | Active |
| US10343896B2 | Method and device of MEMS process control monitoring and packaged MEMS with different cavity pressures | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.