Polymer, organic layer composition, organic layer, and method of forming patterns
US10323124B2 · kind B2 · utility
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6References
15Claims
0Family size
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Key dates
| Filing date | Jun 9, 2015 |
| Grant date | Jun 18, 2019 |
| Priority date | — |
| Expiry date | Jun 9, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G2261/3424
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A polymer including a moiety represented by Chemical Formula 1, an organic layer composition including the polymer, an organic layer manufactured from the organic layer composition, and a method of forming patterns using the organic layer composition are provided.The definitions of the Chemical Formula 1 are the same as defined in the detailed description.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.