Electrical chemical plating process
US10323332B2 · kind B2 · utility
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2References
8Claims
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Key dates
| Filing date | Jul 11, 2016 |
| Grant date | Jun 18, 2019 |
| Priority date | — |
| Expiry date | Oct 8, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76879
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electrical chemical plating process is provided. A semiconductor structure is provided in an electrical plating platform. A pre-electrical-plating step is performed wherein the pre-electrical-plating step is carried out under a fixed voltage environment and lasts for 0.2 to 0.5 seconds after the current is above the threshold current of the electrical plating platform. After the pre-electrical-plating step, a first electrical plating step is performed on the semiconductor structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.