Double-sided plastic fan-out package structure having antenna and manufacturing method thereof
US10325786B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 16, 2018 |
| Grant date | Jun 18, 2019 |
| Priority date | — |
| Expiry date | Mar 16, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/214
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The application provides a double-sided plastic fan-out package structure having an antenna structure. It includes a redistribution layer (RDL); a semiconductor chip, invertedly mounted on a first surface of the redistribution layer with a front surface facing downward; a first plastic encapsulation material layer, located on the first surface of the redistribution layer, encapsulating the semiconductor chip; a second plastic encapsulation material layer, located on a second surface of the redistribution layer; an antenna structure, located on a surface of the second plastic packaging material layer distant from the redistribution layer; an electrical connection structure, located inside the second plastic encapsulation material layer, and electrically connected to the antenna structure on the lower side of the redistribution layer. This structure can shield an interference signal of the antenna structure, thereby preventing the antenna structure from interfering the semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.