Inventor · Jiangyin, CN

Chengtar Wu

37Patents
1h-index
11Co-inventors
43Inventor score

Filing activity: Mar 16, 2018 → Dec 8, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US11211687B2 Method of fabricating a semiconductor structure with an antenna module Electricity 2 Active
US11228089B2 Antenna packaging module and making method thereof Electricity 1 Active
US10777876B2 Antenna feeder package structure and packaging method Electricity 1 Active
US11316252B2 Antenna packaging structure and method for forming the same Electricity 1 Active
US10770394B2 Fan-out semiconductor packaging structure with antenna module and method making the same Electricity 1 Active
US10325786B1 Double-sided plastic fan-out package structure having antenna and manufacturing method thereof Electricity 1 Active
US10714435B2 Fan-out antenna packaging structure and method making the same Electricity 1 Active
US11437707B2 Antenna feeder package structure and packaging method Electricity 0 Active
US11626657B2 Antenna packaging module and making method thereof Electricity 0 Active
US11228087B2 Antenna package structure and antenna packaging method Electricity 0 Active
US10854476B2 Semiconductor vertical wire bonding structure and method Electricity 0 Active
US10886594B2 Packaging structure and packaging method for antenna Electricity 0 Active
US10573609B2 Fan-out antenna packaging structure and preparation thereof Electricity 0 Active
US10854951B2 Antenna package structure and antenna packaging method Electricity 0 Active
US11316247B2 Semiconductor packaging structure having antenna module Electricity 0 Active
US11322852B2 Lens antenna packaging structure, preparation method and electronic device Electricity 0 Active
US11502392B2 Packaging structure and packaging method for antenna Electricity 0 Active
US10916829B2 Semiconductor package structure having antenna module Electricity 0 Active
US11289435B2 Fan-out antenna packaging structure and packaging method Electricity 0 Active
US10777515B2 Fan-out antenna packaging structure and preparation method thereof Electricity 0 Active
US11289793B2 Semiconductor packaging structure having antenna module Electricity 0 Active
US11283152B2 Antenna package structure and antenna packaging method Electricity 0 Active
US11302658B2 Fan-out antenna package structure and packaging method Electricity 0 Active
US11515269B2 Semiconductor packaging structure having antenna module Electricity 0 Active
US11735564B2 Three-dimensional chip packaging structure and method thereof Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.