Surface finish for wirebonding

US10325876B2 · kind B2 · utility

Assignee

• NXP USA, Inc. · US

Inventors

• Varughese Mathew · Austin, US
• Burton J. Carpenter · Austin, US
• Leo M. Higgins, III · Austin, US
• Chu-Chung Lee · Round Rock, US
• Tu-Anh N. Tran · Austin, US

Key dates

• Filing date: Jun 25, 2014
• Grant date: Jun 18, 2019
• Expiry date: Feb 11, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The present disclosure provides embodiments of package devices and methods for making package devices for a semiconductor die. One embodiment includes a die mounting structure having a finished bond pad that includes a copper bond pad and a cobalt-containing layer over a top surface of the copper bond pad, and a wire bond structure that is bonded to a top surface of the cobalt-containing layer of the finished bond pad, where cobalt-containing material of the cobalt-containing layer is located between a bottom surface of the wire bond structure and the top surface of the copper bond pad such that the cobalt-containing material is present under a center portion of the wire bond structure.