Inventor · Austin, TX, US

Burton J. Carpenter

34Patents
6h-index
48Co-inventors
69Inventor score

Filing activity: Sep 17, 1991 → Dec 20, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US5272042A Positive photoresist system for near-UV to visible imaging Emerging Cross-Sectional Technologies 48 Expired
US9012263B1 Method for treating a bond pad of a package substrate Electricity 43 Active
US9437459B2 Aluminum clad copper structure of an electronic component package and a method of making an electronic component package with an aluminum clad copper structure Electricity 42 Active
US5990547A Semiconductor device having plated contacts and method thereof Electricity 26 Expired
US5374500A Positive photoresist composition containing photoacid generator and use thereof Emerging Cross-Sectional Technologies 24 Expired
US5498765A Positive photoresist composition containing photoacid generator and use thereof Emerging Cross-Sectional Technologies 13 Expired
US7808117B2 Integrated circuit having pads and input/output (I/O) cells Electricity 6 Active
US8674509B2 Integrated circuit die assembly with heat spreader Electricity 6 Active
US5266444A Method and composition for obtaining image reversal in epoxy formulations based upon photoinhibition Emerging Cross-Sectional Technologies 5 Expired
US9059144B2 Method for forming die assembly with heat spreader Electricity 3 Active
US10446476B2 Packaged integrated circuit having stacked die and method for therefor Electricity 3 Active
US10325876B2 Surface finish for wirebonding Electricity 3 Active
US8754521B1 Semiconductor device assembly having a heat spreader Electricity 3 Active
US9111878B2 Method for forming a semiconductor device assembly having a heat spreader Electricity 2 Active
US8754518B1 Devices and methods for configuring conductive elements for a semiconductor package Electricity 2 Active
US8704370B2 Semiconductor package structure having an air gap and method for forming Electricity 1 Active
US9368470B2 Coated bonding wire and methods for bonding using same Electricity 0 Active
US11462494B2 Semiconductor device package having galvanic isolation and method therefor Electricity 0 Active
US8802508B2 Semiconductor device package Electricity 0 Active
US10734312B2 Packaged integrated circuit having stacked die and method for therefor Electricity 0 Active
US11164826B2 Packaged integrated circuit having stacked die and method for making Electricity 0 Active
US8556159B2 Embedded electronic component Emerging Cross-Sectional Technologies 0 Active
US10249557B2 Packaged integrated circuit device and methods Electricity 0 Active
US10734311B2 Hybrid lead frame for semiconductor die package with improved creepage distance Electricity 0 Active
US12040291B2 Radio frequency packages containing multilevel power substrates and associated fabrication methods Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.