Hybrid 3D/2.5D interposer
US10325880B2 · kind B2 · utility
4Cited by
4References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2018 |
| Grant date | Jun 18, 2019 |
| Priority date | — |
| Expiry date | Nov 21, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Representative implementations of devices and techniques provide a hybrid interposer for 3D or 2.5D package arrangements. A quantity of pockets is formed on a surface of a carrier in a predetermined pattern. The pockets are filled with a reflowable conductive material. Chip dice are coupled to the interposer carrier by fixing terminals of the dice into the pockets. The carrier may include topside and backside redistribution layers to provide fanout for the chip dice, for coupling the interposer to another carrier, board, etc. having a pitch greater than that of the chip dice.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.