Patent assignee · US · COMPANY

Invensas LLC

549Patents
546Active
549Granted
62Portfolio score

Filing activity: Oct 26, 2006 → Aug 23, 2022 · 23 expiring within 5 years

Most-cited patents

PatentTitleAreaCited byStatus
US9165793B1 Making electrical components in handle wafers of integrated circuit packages Electricity 311 Active
US9824974B2 Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies Electricity 176 Active
US9741620B2 Structures and methods for reliable packages Electricity 165 Active
US10446456B2 Integrated circuits protected by substrates with cavities, and methods of manufacture Electricity 152 Active
US9899442B2 Image sensor device Electricity 134 Active
US11329034B2 Direct-bonded LED structure contacts and substrate contacts Electricity 124 Active
US11264357B1 Mixed exposure for large die Electricity 123 Active
US10854578B2 Diffused bitline replacement in stacked wafer memory Electricity 123 Active
US10892246B2 Structures and methods for low temperature bonding using nanoparticles Electricity 123 Active
US11355443B2 Dielets on flexible and stretchable packaging for microelectronics Electricity 123 Active
US10840135B2 Flat metal features for microelectronics applications Electricity 122 Active
US8878353B2 Structure for microelectronic packaging with bond elements to encapsulation surface Emerging Cross-Sectional Technologies 122 Active
US8372741B1 Method for package-on-package assembly with wire bonds to encapsulation surface Electricity 95 Active
US8404520B1 Package-on-package assembly with wire bond vias Emerging Cross-Sectional Technologies 93 Active
US11069734B2 Image sensor device Electricity 88 Active
US8680684B2 Stackable microelectronic package structures Electricity 87 Active
US8836136B2 Package-on-package assembly with wire bond vias Emerging Cross-Sectional Technologies 82 Active
US8670261B2 Stub minimization using duplicate sets of signal terminals Electricity 72 Active
US9379074B2 Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects Electricity 70 Active
US9812185B2 DRAM adjacent row disturb mitigation Physics 66 Active
US9095074B2 Structure for microelectronic packaging with bond elements to encapsulation surface Emerging Cross-Sectional Technologies 66 Active
US8299368B2 Interconnection element for electric circuits Electricity 66 Active
US9263394B2 Multiple bond via arrays of different wire heights on a same substrate Electricity 62 Active
US9105483B2 Package-on-package assembly with wire bond vias Emerging Cross-Sectional Technologies 62 Active
US9666559B2 Multichip modules and methods of fabrication Electricity 61 Active

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.