Washable mold for conformable layer formation on semiconductor devices
US10326040B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2018 |
| Grant date | Jun 18, 2019 |
| Priority date | — |
| Expiry date | Feb 22, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/036
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments relate to forming a conformable interface layers (clayers) on small semiconductor devices, such as light emitting diodes (LEDs) to facilitate adhesion with a pick-up head for operations during the manufacturing of an electronic display. A conformable material is formed in regions between LED dies on a carrier substrate and over the LED dies. A mask is applied over the conformable material to selectively cover the conformable material. Portions of the conformable material are exposed to light to selectively cure or not cure the portions of the conformable material. The conformable material between the LED dies is removed to form a conformable interface layer over each of the LED dies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.