Inventor · Riegelsberg, DE

Karsten Moh

16Patents
2h-index
24Co-inventors
50Inventor score

Filing activity: Nov 23, 2011 → Sep 9, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US10586725B1 Method for polymer-assisted chip transfer Electricity 2 Active
US11145797B1 Forming conformable layer with flap on semiconductor devices Electricity 2 Active
US10323324B2 Method for producing patterned metallic coatings Chemistry; Metallurgy 1 Active
US10964867B2 Using underfill or flux to promote placing and parallel bonding of light emitting diodes Electricity 1 Active
US11655396B2 Double-sided reversible adhesive structure Chemistry; Metallurgy 1 Active
US12024656B2 Moulded body comprising a structured surface for controlled adhesion Chemistry; Metallurgy 0 Active
US10326040B1 Washable mold for conformable layer formation on semiconductor devices Electricity 0 Active
US10941035B2 Method for producing structured surfaces Emerging Cross-Sectional Technologies 0 Active
US11873849B2 Shaped body having a structured surface for reversible adhesion Chemistry; Metallurgy 0 Active
US10559486B1 Method for polymer-assisted chip transfer Electricity 0 Active
US10822697B2 Method for producing metal structures Emerging Cross-Sectional Technologies 0 Active
US10388516B1 Method for polymer-assisted chip transfer Electricity 0 Active
US10910514B1 Molded etch masks Electricity 0 Active
US12068443B1 Forming conformable layer with flap on semiconductor devices Electricity 0 Active
US11787982B2 Structure with improved adhesion Chemistry; Metallurgy 0 Active
US10763135B2 Integrated elastomeric interface layer formation and singulation for light emitting diodes Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.