Printed circuit board and method for producing a printed circuit board
US10327325B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2016 |
| Grant date | Jun 18, 2019 |
| Priority date | — |
| Expiry date | Jun 21, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8585
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board (1) comprising an insulating layer (2) and a conducting layer (3) arranged on the insulating layer (2) and structured into a contact surface (4) for an electronic component (11) which is to be populated on the printed circuit board (1) has, in the area of the contact surface (4), at least one channel (8) that passes through the contact surface (4) and the insulating layer (2) and that is filled with a thermally conductive material. The process is characterized by the steps of preparing an insulating layer (2) and a conducting layer (3) connected with the insulating layer (2); producing at least one channel (8) passing through the conducting layer (2) and the insulating layer (3); lining the channel (8) with thermally conductive material; structuring the conducting layer (3) into a contact surface (4) for an electronic component (11) to be populated on the printed circuit board; preparing a solder deposit (9) at least minimally overlapping with the contact surface (4); setting down the electronic component (11); melting the solder, and cooling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.