Erik Edlinger
6Patents
2h-index
4Co-inventors
33Inventor score
Filing activity: Nov 5, 2015 → Jan 16, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10327325B2 | Printed circuit board and method for producing a printed circuit board | Electricity | 8 | Active |
| US10843284B2 | Method for void reduction in solder joints | Emerging Cross-Sectional Technologies | 3 | Active |
| US11272617B2 | Electronic printed circuit board assembly for high-power components | Electricity | 1 | Active |
| US11116071B2 | Method for producing a printed circuit board having thermal through-contacts | Electricity | 0 | Active |
| US10408403B2 | Headlamp for vehicles having at least one laser light source | Mechanical Engineering; Lighting; Heating | 0 | Active |
| US10638637B2 | Component cooling device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.