Electronic sensor supported on rigid substrate
US10331934B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 17, 2016 |
| Grant date | Jun 25, 2019 |
| Priority date | — |
| Expiry date | Dec 16, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/4985
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A sensor assembly comprises a rigid substrate with a circuit subassembly wrapped therearound. The circuit subassembly includes a flexible substrate with conductive traces and interconnects formed thereon, and when wrapped around the rigid substrate, the conductive traces may overlap one another so as to form capacitive sensor elements. The interconnects connect the conductive traces to one or more components, such as a printed circuit board attached to a portion of the flexible substrate. The sensor assembly maybe installed in an opening formed in a host device panel of a host device, such as a smart phone, with the sensor assembly optionally peripherally surrounded by a spacer frame, and covered by a cover element. The circuit subassembly may include a host connector tab for electrically connecting the sensor assembly to electrical components of a host device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.