David Rodney Baker
8Patents
5h-index
10Co-inventors
60Inventor score
Filing activity: Oct 27, 1998 → Apr 5, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6255723A | Layered lead structures | Electricity | 16 | Expired |
| US6465744B2 | Graded metallic leads for connection to microelectronic elements | Emerging Cross-Sectional Technologies | 11 | Expired |
| US9680273B2 | Electrical connector with electrical contacts protected by a layer of compressible material and method of making it | Emerging Cross-Sectional Technologies | 9 | Active |
| US6248656A | Metal-jacketed lead manufacturing process using resist layers | Electricity | 8 | Expired |
| US6573459B2 | Graded metallic leads for connection to microelectronic elements | Emerging Cross-Sectional Technologies | 8 | Expired |
| US10331934B2 | Electronic sensor supported on rigid substrate | Electricity | 2 | Active |
| US10776600B2 | Electronic sensor supported on rigid substrate | Electricity | 2 | Active |
| US10387707B2 | Reinforcement panel for fingerprint sensor cover | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.