Power management application of interconnect substrates
US10332827B2 · kind B2 · utility
1Cited by
14References
25Claims
0Family size
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Key dates
| Filing date | Dec 9, 2016 |
| Grant date | Jun 25, 2019 |
| Priority date | — |
| Expiry date | Jan 20, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/381
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various applications of interconnect substrates in power management systems are described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.