Mihalis Michael
11Patents
5h-index
9Co-inventors
59Inventor score
Filing activity: Aug 3, 1999 → Jul 31, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6778390B2 | High-performance heat sink for printed circuit boards | Electricity | 62 | Expired |
| US6214640A | Method of manufacturing a plurality of semiconductor packages | Electricity | 57 | Expired |
| US6230400A | Method for forming interconnects | Emerging Cross-Sectional Technologies | 26 | Expired |
| US6555759B2 | Interconnect structure | Emerging Cross-Sectional Technologies | 13 | Expired |
| US9099340B2 | Power management applications of interconnect substrates | Electricity | 8 | Active |
| US9520342B2 | Power management applications of interconnect substrates | Electricity | 4 | Active |
| US10332827B2 | Power management application of interconnect substrates | Electricity | 1 | Active |
| US9070662B2 | Chip-scale packaging with protective heat spreader | Electricity | 1 | Active |
| US11296019B1 | Vertically structured pad system | Electricity | 0 | Active |
| US9806001B2 | Chip-scale packaging with protective heat spreader | Electricity | 0 | Active |
| US10748845B2 | Power management application of interconnect substrates | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.