Package structure of light emitter and light sensor with light-blocking layer and method for manufacturing the same
US10333019B2 · kind B2 · utility
0Cited by
4References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 25, 2017 |
| Grant date | Jun 25, 2019 |
| Priority date | — |
| Expiry date | May 25, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F99/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A package structure and a method for manufacturing the same are disclosed. The package structure includes a first plastic body which covers a first light sensor and a light emitter, and a second plastic body which is made of infrared cutoff materials and fills inner pins of a lead frame or is formed below the lead frame. A trench is formed in the first plastic body so that a light-blocking layer is located on a side surface of the first plastic body. The second plastic body and the light-blocking layer are used to avoid influence of infrared light on a first light sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.