Inventor · Hangzhou City, CN

Jiaming Ye

18Patents
1h-index
15Co-inventors
47Inventor score

Filing activity: Feb 10, 2012 → Jun 1, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US9559043B2 Multi-level leadframe with interconnect areas for soldering conductive bumps, multi-level package assembly and method for manufacturing the same Electricity 5 Active
US9508677B2 Chip package assembly and manufacturing method thereof Electricity 1 Active
US9595453B2 Chip package method and package assembly Electricity 1 Active
US9101924B2 Interface device for bio-chip Performing Operations; Transporting 0 Active
US10758903B2 Microfluidic devices for multi-index biochemical detection Mechanical Engineering; Lighting; Heating 0 Active
US9677133B2 Biological chip hybridization system Physics 0 Active
US9699918B2 Package assembly and method for manufacturing the same Electricity 0 Active
US10741481B2 Integrated package assembly for switching regulator Electricity 0 Active
US12394743B2 Die attachment structure and method for manufacturing the same Electricity 0 Active
US10083895B2 Package structure for power converter and manufacture method thereof Electricity 0 Active
US10333019B2 Package structure of light emitter and light sensor with light-blocking layer and method for manufacturing the same Electricity 0 Active
US11742268B2 Package structure applied to power converter Electricity 0 Active
US11232999B2 Chip package structure and method for forming chip package Electricity 0 Active
US11056421B2 Package structure for power converter and manufacture method thereof Electricity 0 Active
US10128221B2 Package assembly having interconnect for stacked electronic devices and method for manufacturing the same Electricity 0 Active
US10043738B2 Integrated package assembly for switching regulator Electricity 0 Active
US9671317B2 Automatic injection device for microarray chip and automatic injection hybridization microarray chip Physics 0 Active
US10615106B2 Chip package structure and method for forming chip package Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.