Method for creating patterns
US10336023B2 · kind B2 · utility
0Cited by
4References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2015 |
| Grant date | Jul 2, 2019 |
| Priority date | — |
| Expiry date | Dec 22, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0136
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates in particular to a method for creating patterns in a layer (410) to be etched, starting from a stack comprising at least the layer (410) to be etched and a masking, layer (420) on top of the layer (410) to be etched, the masking layer (420) having at least one pattern (421), the method comprising at least:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.