Method for making an electronic component package
US10340251B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2017 |
| Grant date | Jul 2, 2019 |
| Priority date | — |
| Expiry date | Jul 21, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/2064
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In making electronic component packages, a method includes forming a sacrificial material over a first temporary substrate, applying a second temporary substrate to the sacrificial material, and then curing the sacrificial material. After curing, the second temporary substrate is removed. The top surface of the sacrificial layer is defined by the second temporary substrate. After removal, a redistribution structure is formed on the top surface. After the formation of the redistribution structure, electronic components are applied to the redistribution structure. The electronic components are encapsulated to form an encapsulated panel. The first temporary substrate and the sacrificial material are removed. The panel is singulated into multiple electronic component packages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.