Inventor · Sunnyvale, CA, US

Jason Wright

36Patents
7h-index
44Co-inventors
69Inventor score

Filing activity: Oct 28, 2002 → Sep 11, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US8900364B2 High productivity vapor processing system Chemistry; Metallurgy 183 Active
US9299670B2 Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof Electricity 39 Active
US8216918B2 Method of forming a packaged semiconductor device Electricity 17 Active
US6832950B2 Polishing pad with window Emerging Cross-Sectional Technologies 15 Expired
US8592241B2 Method for packaging an electronic device assembly having a capped device interconnect Electricity 12 Active
US9331029B2 Microelectronic packages having mold-embedded traces and methods for the production thereof Electricity 10 Active
US9142502B2 Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduits Electricity 8 Active
US9093457B2 Stacked microelectronic packages having patterned sidewall conductors and methods for the fabrication thereof Electricity 7 Active
US7845308B1 Systems incorporating microwave heaters within fluid supply lines of substrate processing chambers and methods for use of such systems Electricity 6 Active
US9190390B2 Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof Electricity 5 Active
US8733280B2 Showerhead for processing chamber Chemistry; Metallurgy 4 Active
US9025340B2 Devices and stacked microelectronic packages with in-trench package surface conductors and methods of their fabrication Emerging Cross-Sectional Technologies 4 Active
US9502363B2 Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers Electricity 3 Active
US8609519B2 Combinatorial approach for screening of ALD film stacks Electricity 3 Active
US9761570B1 Electronic component package with multple electronic components Electricity 2 Active
US9305911B2 Devices and stacked microelectronic packages with package surface conductors and adjacent trenches and methods of their fabrication Electricity 2 Active
US9064977B2 Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof Electricity 2 Active
US10340251B2 Method for making an electronic component package Electricity 2 Active
US7892950B2 Methodology for processing a panel during semiconductor device fabrication Electricity 1 Active
US12223106B2 Systems and methods for generic control using a neural signal Physics 1 Active
US8925481B2 Systems and methods for measuring, monitoring and controlling ozone concentration Emerging Cross-Sectional Technologies 1 Active
US10998231B2 Method for increasing semiconductor device wafer strength Electricity 1 Active
US9899298B2 Microelectronic packages having mold-embedded traces and methods for the production thereof Emerging Cross-Sectional Technologies 1 Active
US9257415B2 Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof Electricity 1 Active
US11673161B2 Methods of manufacturing electrostatic chucks Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.