Semiconductor devices including support patterns
US10340277B2 · kind B2 · utility
3Cited by
7References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2017 |
| Grant date | Jul 2, 2019 |
| Priority date | — |
| Expiry date | Sep 22, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D89/10
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a plurality of pillar structures on a semiconductor substrate, and a support pattern in contact with at least a part of each of the pillar structures, the support pattern connecting the pillar structures with one another, wherein the support pattern includes support holes exposing side surfaces of the pillar structures, the support holes including at least a first support hole and a second support hole that are spaced apart from each other, the first and second support holes having different shapes from each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.