Inventor · Seongnam-si, KR

Wonchul Lee

30Patents
5h-index
41Co-inventors
65Inventor score

Filing activity: Jun 4, 2007 → May 1, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US8609546B2 Pulsed bias plasma process to control microloading Electricity 22 Active
US8969936B2 Semiconductor devices having increased contact areas between contacts and active regions and methods of fabricating the same Electricity 13 Active
US9379114B2 Semiconductor device and method of fabricating the same Electricity 7 Active
US7629255B2 Method for reducing microloading in etching high aspect ratio structures Electricity 6 Active
US9519576B2 Memory controller, method of operating the same and memory system including the same Physics 5 Active
US8518282B2 Method of controlling etch microloading for a tungsten-containing layer Electricity 5 Active
US10340277B2 Semiconductor devices including support patterns Electricity 3 Active
US10720435B2 Semiconductor devices including support patterns Electricity 3 Active
US10347641B2 Semiconductor devices Electricity 2 Active
US9129902B2 Continuous plasma ETCH process Electricity 2 Active
US9213598B2 Nonvolatile memory device and method of operating the same Physics 2 Active
US8124538B2 Selective etch of high-k dielectric material Electricity 1 Active
US11670591B2 Semiconductor device and method of fabricating same Electricity 1 Active
US9348708B2 Memory system performing address mapping according to bad page map Physics 1 Active
US11742212B2 Directional deposition in etch chamber Electricity 0 Active
US11917812B2 Semiconductor devices Electricity 0 Active
US12426248B2 Semiconductor devices Electricity 0 Active
US12417977B2 Semiconductor device and method of fabricating same Electricity 0 Active
US11195837B2 Semiconductor devices including support patterns Electricity 0 Active
US11329050B2 Semiconductor memory devices having contact plugs Electricity 0 Active
US12408330B2 Semiconductor memory device Electricity 0 Active
US8802571B2 Method of hard mask CD control by Ar sputtering Electricity 0 Active
US9530658B2 Continuous plasma etch process Electricity 0 Active
US9607848B2 Etch process with pre-etch transient conditioning Electricity 0 Active
US9142417B2 Etch process with pre-etch transient conditioning Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.