Heat sink attachment on existing heat sinks
US10342160B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2017 |
| Grant date | Jul 2, 2019 |
| Priority date | — |
| Expiry date | Nov 3, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/4006
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Structures and methods for providing heat sink attachments on existing heat sinks. According to a device, a first heat sink comprises a first base and fins extending from the first base. The first base comprises a cutout therein and a first base bottom surface contacting a first electronic component. A second heat sink comprises a second base and fins extending from the second base. The second heat sink is located in the cutout of the first heat sink. The second base comprises a second base bottom surface contacting a second electronic component. A pressure plate is attached to the first heat sink and overlays the second heat sink. The pressure plate contacts the second heat sink and applies pressure between the second heat sink and the second electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.