Inventor · Poughquag, NY, US

Kenneth C. Marston

27Patents
8h-index
65Co-inventors
78Inventor score

Filing activity: Apr 19, 2001 → Jun 19, 2020

Most-cited inventions

PatentTitleAreaCited byStatus
US7928562B2 Segmentation of a die stack for 3D packaging thermal management Electricity 49 Active
US7808781B2 Apparatus and methods for high-performance liquid cooling of multiple chips with disparate cooling requirements Electricity 32 Active
US7834442B2 Electronic package method and structure with cure-melt hierarchy Electricity 24 Active
US8115303B2 Semiconductor package structures having liquid coolers integrated with first level chip package modules Electricity 18 Active
US8202765B2 Achieving mechanical and thermal stability in a multi-chip package Electricity 17 Active
US8421217B2 Achieving mechanical and thermal stability in a multi-chip package Electricity 15 Active
US9401315B1 Thermal hot spot cooling for semiconductor devices Electricity 11 Active
US8772927B2 Semiconductor package structures having liquid cooler integrated with first level chip package modules Electricity 9 Active
US7917328B2 Tracking thermal mini-cycle stress Physics 6 Active
US6703560B2 Stress resistant land grid array (LGA) module and method of forming the same Electricity 6 Expired
US10172258B2 Cooling structure for electronic boards Electricity 5 Active
US9721870B2 Cooling structure for electronic boards Electricity 5 Active
US8363404B2 Implementing loading and heat removal for hub module assembly Electricity 5 Active
US10757833B2 Cooling structure for electronic boards Electricity 4 Active
US6964885B2 Stress resistant land grid array (LGA) module and method of forming the same Electricity 4 Expired
US7239516B2 Flexure plate for maintaining contact between a cooling plate/heat sink and a microchip Electricity 4 Expired
US9883612B2 Heat sink attachment on existing heat sinks Electricity 2 Active
US8214658B2 Enhanced thermal management for improved module reliability Emerging Cross-Sectional Technologies 2 Active
US10342160B2 Heat sink attachment on existing heat sinks Electricity 1 Active
US9272498B2 Precast thermal interface adhesive for easy and repeated, separation and remating Emerging Cross-Sectional Technologies 1 Active
US11152282B1 Localized catalyst for enhanced thermal interface material heat transfer Electricity 1 Active
US10905029B2 Cooling structure for electronic boards Electricity 0 Active
US8268389B2 Precast thermal interface adhesive for easy and repeated, separation and remating Emerging Cross-Sectional Technologies 0 Active
US10542636B2 Cooling structure for electronic boards Electricity 0 Active
US11164804B2 Integrated circuit (IC) device package lid attach utilizing nano particle metallic paste Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.