Substrate processing apparatus, substrate processing method, and storage medium with program stored therein for executing substrate processing method
US10347482B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2017 |
| Grant date | Jul 9, 2019 |
| Priority date | — |
| Expiry date | Dec 26, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32139
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to a processing liquid supplying unit configured to supply a processing liquid that contains a removing agent of an adhered substance and a solvent having a boiling point lower than a boiling point of the removing agent to a substrate, a substrate heating unit configured to subsequently heat the substrate at a predetermined temperature that is equal to or higher than the boiling point of the solvent in the processing liquid and is lower than the boiling point of the removing agent, and a rinsing liquid supplying unit configured to subsequently supply a rinsing liquid to the substrate so as to remove the adhered substance from the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.