Patent · US Active

Diodes offering asymmetric stability during fluidic assembly

US10347513B2 · kind B2 · utility

3Cited by
28References
24Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 1, 2018
Grant dateJul 9, 2019
Priority date
Expiry dateJan 1, 2038

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10H20/84
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.