Heater for bonding apparatus and method of cooling the same
US10350692B2 · kind B2 · utility
1Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 15, 2015 |
| Grant date | Jul 16, 2019 |
| Priority date | — |
| Expiry date | Jan 15, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/75502
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Provided is a plate-like heater for a bonding apparatus (30) including: a lower surface (31b) to which a bonding tool (40) is attached; and an upper surface (31a) to which a heat insulator (20) is attached. The upper surface (31a) is provided with a large number of capillary slits (35), and the large number of capillary slits (35) and a matching surface (21) of the heat insulator (20) attached to the upper surface (31a) form a large number of capillary coolant flow-paths (37) each extending from a cavity (36) to a lateral surface (33). This allows effective cooling of the heater for a bonding apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.