Kohei Seyama
44Patents
2h-index
20Co-inventors
53Inventor score
Filing activity: Oct 6, 2006 → Dec 13, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7886956B2 | Bonding apparatus and bonding stage height adjustment method for the bonding apparatus | Electricity | 3 | Active |
| US9406640B2 | Flip chip bonder and method of correcting flatness and deformation amount of bonding stage | Electricity | 2 | Active |
| US11373975B2 | Electronic component mounting device | Electricity | 2 | Active |
| US7735707B2 | Wire bonding apparatus | Electricity | 2 | Active |
| US9536856B2 | Flip chip bonder and flip chip bonding method | Electricity | 2 | Active |
| US7780056B2 | Horn attachment arm | Electricity | 2 | Active |
| US10497590B2 | Electronic component handling unit | Electricity | 1 | Active |
| US10477697B2 | Mounting apparatus | Electricity | 1 | Active |
| US8052026B2 | Ultrasonic horn | Electricity | 1 | Active |
| US11410866B2 | Apparatus and method for linearly moving movable body relative to object | Electricity | 1 | Active |
| US10340163B2 | Mounting apparatus | Electricity | 1 | Active |
| US8152043B2 | Ultrasonic horn | Electricity | 1 | Active |
| US11509126B2 | Wiring structure with movement mechanism | Performing Operations; Transporting | 1 | Active |
| US8511534B2 | Ultrasonic horn | Electricity | 1 | Active |
| US10350692B2 | Heater for bonding apparatus and method of cooling the same | Electricity | 1 | Active |
| US10910248B2 | Electronic component mounting apparatus | Electricity | 1 | Active |
| US8181527B2 | Method and apparatus for pass/fail determination of bonding and bonding apparatus | Electricity | 1 | Active |
| US8800843B2 | Bonding apparatus | Electricity | 1 | Active |
| US7578421B2 | Horn-holder pivot type bonding apparatus | Emerging Cross-Sectional Technologies | 1 | Active |
| US9968020B2 | Electronic-component mounting apparatus | Electricity | 1 | Active |
| US11139193B2 | Device and method for positioning first object in relation to second object | Electricity | 0 | Active |
| US12191276B2 | Mounting apparatus | Electricity | 0 | Active |
| US12176317B2 | Semiconductor device manufacturing device and manufacturing method | Electricity | 0 | Active |
| US11508688B2 | Bonding apparatus including a heater and a cooling flow path used for stacking a plurality of semiconductor chips | Electricity | 0 | Active |
| US11469125B2 | Device and method for linearly moving first and second moving bodies relative to target object | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.