Systems and methods for wafer structure uniformity monitoring using interferometry wafer geometry tool
US10352691B1 · kind B1 · utility
3Cited by
3References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2014 |
| Grant date | Jul 16, 2019 |
| Priority date | — |
| Expiry date | Nov 3, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B2210/56
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Systems and methods for processing phase maps acquired using interferometer wafer geometry tools are disclosed. More specifically, instead of performing phase unwrapping first and then analyze the unwrapped data in a height domain, systems and methods in accordance with the present disclosure operate in a curvature domain without having to perform any phase unwrapping.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.