Systems and methods for measuring physical characteristics of semiconductor device elements using structured light
US10352877B2 · kind B2 · utility
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17Claims
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Key dates
| Filing date | Oct 18, 2017 |
| Grant date | Jul 16, 2019 |
| Priority date | — |
| Expiry date | Oct 27, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3512
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of determining a physical characteristic of an adhesive material on a semiconductor device element using structured light is provided. The method includes the steps of: (1) applying a structured light pattern to an adhesive material on a semiconductor device element; (2) creating an image of the structured light pattern using a camera; and (3) analyzing the image of the structured light pattern to determine a physical characteristic of the adhesive material. Additional methods and systems for determining physical characteristics of semiconductor devices and elements using structured light are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.