Method for manufacturing planar coil
US10354796B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2017 |
| Grant date | Jul 16, 2019 |
| Priority date | — |
| Expiry date | Dec 13, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is a method for manufacturing a planar coil, the method including forming a base conductive layer on a base material, the base conductive layer including: a coil wiring portion having one end, other end, and first to third connecting positions, the second connecting position being closer to the other end compared with the first connecting position, the third connecting position being closer to the one end compared with the second connecting position; a power-feed wiring portion that connects the first connecting position with an external power source; and a connection wiring portion that short-circuits the second connecting position and the third connecting position; forming a wiring conductive layer on the base conductive layer by electrolytic plating by feeding power from the external power source; and removing the power-feed wiring portion and the connection wiring portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.