Flip chip integration on qubit chips
US10355193B2 · kind B2 · utility
8Cited by
36References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 28, 2017 |
| Grant date | Jul 16, 2019 |
| Priority date | — |
| Expiry date | Nov 28, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06593
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A quantum bit (qubit) flip chip assembly may be formed when a qubit it formed on a first chip and an optically transmissive path is formed on a second chip. The two chips may be bonded using solder bumps. The optically transmissive path may provide optical access to the qubit on the first chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.