Electronic device module and method of manufacturing the same
US10356911B2 · kind B2 · utility
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1References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2015 |
| Grant date | Jul 16, 2019 |
| Priority date | — |
| Expiry date | Aug 4, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device module includes: a board including at least one mounting electrode and at least one external connection electrode and having a protective insulation layer which is provided on an outer surface thereof; at least one electronic device mounted on the mounting electrodes; a molded part sealing the electronic device; and at least one connective conductor of which one end is bonded to the external connection electrode of the board and which penetrates through the molded part to be disposed in the molded part, wherein the protective insulation layer is disposed to be spaced apart from the connective conductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.