Substrate treating apparatus and method
US10357806B2 · kind B2 · utility
1Cited by
0References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2015 |
| Grant date | Jul 23, 2019 |
| Priority date | — |
| Expiry date | Sep 10, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67051
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The inventive concepts provide an apparatus for treating a substrate. The apparatus includes a housing proving an inner space in which a substrate is treated, a spin head supporting and rotating the substrate in the housing, an injection unit comprising a first nozzle member spraying a first treatment solution to the substrate put on the spin head, and a controller controlling the first nozzle member. The first nozzle member includes a body, a vibrator, a pump, and a power source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.