Dendritic silver powder
US10357824B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2016 |
| Grant date | Jul 23, 2019 |
| Priority date | — |
| Expiry date | Oct 14, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12014
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A new dendritic silver powder can be mixed with a synthetic resin to give electroconductive films having sufficient electroconductivity. Even when the films vary in thickness, the electroconductivity of the films can be maintained. The volume-cumulative particle diameter D50 (referred to as “D50D”) determined by adding the silver powder to water containing a dispersant, applying 300-watt ultrasonic waves to the resultant mixture for 3 minutes, and examining the dispersion with a laser diffraction/scattering type particle size analyzer is 1.0-15.0 μm and that the ratio of the volume-cumulative particle diameter D50 (referred to as “D50N”) determined by adding the silver powder to the water containing a dispersant and examining the mixture under the same conditions as for the D50D except that no ultrasonic waves are applied, to the D50D, D50N/D50D, is 1.0-10.0.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.