Inventor · Hiroshima, JP

Hiroyuki Morinaka

14Patents
5h-index
15Co-inventors
63Inventor score

Filing activity: Jun 5, 1995 → Oct 14, 2016

Most-cited inventions

PatentTitleAreaCited byStatus
US5781062A Semiconductor integrated circuit Electricity 51 Expired
US6820107B1 Square root extraction circuit and floating-point square root extraction device Physics 30 Expired
US5633524A Gate array semiconductor integrated circuit device Electricity 15 Expired
US5631860A Carry Selecting system type adder Physics 12 Expired
US5646555A Pipeline structure using positive edge and negative edge flip-flops to decrease the size of a logic block Electricity 10 Expired
US6005422A Semiconductor integrated circuit and consumed power reducing method Electricity 4 Expired
US5859800A Data holding circuit and buffer circuit Electricity 4 Expired
US5747847A Semiconductor integrated circuit device, method for manufacturing the same, and logical circuit Electricity 3 Expired
US6375784B1 Method of manufacturing reversible heat-sensitive recording medium and reversible heat-sensitive recording medium manufactured thereby Performing Operations; Transporting 2 Expired
US6001518A Reversible heat-sensitive recording material with high color development and image stabilization capabilities Emerging Cross-Sectional Technologies 1 Expired
US6148318A Square root extraction circuit and floating-point square root extraction device Physics 1 Expired
US10357824B2 Dendritic silver powder Emerging Cross-Sectional Technologies 0 Active
US5891765A Method of fabricating a gate array semiconductor integrated circuit device Electricity 0 Expired
US10486231B2 Silver-coated copper powder Emerging Cross-Sectional Technologies 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.