Microfluidic assembly and methods of forming same
US10357964B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 9, 2018 |
| Grant date | Jul 23, 2019 |
| Priority date | — |
| Expiry date | Mar 9, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2002/14491
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
One or more embodiments are directed to a microfluidic assembly that includes an interconnect substrate coupled to a microfluidic die. In one embodiment, the microfluidic die includes a ledge with a plurality of bond pads. The microfluidic assembly further includes an interconnect substrate having an end resting on the ledge proximate the bond pads. In another embodiment, the interconnect substrate abuts a side surface of the ledge or is located proximate the ledge. Conductive elements couple the microfluidic die to contacts of the interconnect substrate. Encapsulant is located over the conductive elements, the bond pads, the contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.