STMicroelectronics (Malta) Ltd
40Patents
40Active
40Granted
53Portfolio score
Filing activity: Jul 16, 2007 → Dec 12, 2022 · 3 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7875942B2 | Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type | Electricity | 24 | Active |
| US9449912B1 | Integrated circuit (IC) card having an IC module and reduced bond wire stress and method of forming | Electricity | 7 | Active |
| US9769554B2 | Semiconductor integrated device for acoustic applications with contamination protection element, and manufacturing method thereof | Electricity | 5 | Active |
| US8837754B2 | Microelectromechanical transducer and corresponding assembly process | Emerging Cross-Sectional Technologies | 5 | Active |
| US10225635B2 | Microelectromechanical microphone | Electricity | 4 | Active |
| US9620438B2 | Electronic device with heat dissipater | Electricity | 3 | Active |
| US10600704B2 | Electronic device comprising a support substrate and an encapsulating cover for an electronic component | Electricity | 2 | Active |
| US9253579B2 | Package for a MEMS sensor and manufacturing process thereof | Electricity | 2 | Active |
| US11032629B2 | Microelectromechanical microphone | Electricity | 1 | Active |
| US9950511B2 | Microfluidic assembly and methods of forming same | Performing Operations; Transporting | 1 | Active |
| US9257372B2 | Surface mount package for a semiconductor integrated device, related assembly and manufacturing process | Emerging Cross-Sectional Technologies | 1 | Active |
| US10329143B2 | Package with chambers for dies and manufacturing process thereof | Electricity | 1 | Active |
| US8546895B2 | Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type | Electricity | 1 | Active |
| US8921164B2 | Semiconductor integrated device assembly process | Electricity | 1 | Active |
| US8043881B2 | Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type | Electricity | 1 | Active |
| US9290377B2 | Method of stacking a plurality of dies to form a stacked semiconductor device, and stacked semiconductor device | Electricity | 0 | Active |
| US10892201B2 | Electronic device comprising a support substrate and an encapsulating cover for an electronic component | Electricity | 0 | Active |
| US11352251B2 | Electronic device and corresponding manufacturing method | Electricity | 0 | Active |
| US12148628B2 | Semiconductor device and corresponding method | Electricity | 0 | Active |
| US11309237B2 | Semiconductor package with wettable slot structures | Electricity | 0 | Active |
| US8618676B2 | Method of assembly of a semiconductor package for the improvement of the electrical testing yield on the packages so obtained | Electricity | 0 | Active |
| US10435290B2 | Wafer level package for a MEMS sensor device and corresponding manufacturing process | Electricity | 0 | Active |
| US10431514B2 | Semiconductor packages having dual encapsulation material | Electricity | 0 | Active |
| US9527727B2 | Packages for semiconductor devices and methods for assembling same | Electricity | 0 | Active |
| US9446943B2 | Wafer-level packaging of integrated devices, and manufacturing method thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.