Apparatus and methods for treating a substrate
US10361100B2 · kind B2 · utility
5Cited by
40References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2016 |
| Grant date | Jul 23, 2019 |
| Priority date | — |
| Expiry date | Jan 30, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6715
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate treatment apparatus is provided. The apparatus may include a process chamber configured to have an internal space, a substrate supporting member disposed in the process chamber to support a substrate, a first supplying port configured to supply a supercritical fluid to a region of the internal space located below the substrate, a second supplying port configured to supply a supercritical fluid to other region of the internal space located over the substrate, and an exhaust port configured to exhaust the supercritical fluid from the process chamber to an exterior region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.